MSI has already confirmed DDR5 memory overclocking profiles and published an installation guide for the AMD Ryzen 7000 Engineering Sample CPU. AMD wasn't too happy about MSI letting all the information out of the bag because Computex was just meant to be a showcase and not a full reveal. As a result, some of this information has already been removed at AMD's direction.
But MSI obviously doesn't mind. During their MSI Insider Stream, the company showed off the AMD X670 chipset design without a heat spreader. In fact, this is the first time we've seen the dual-chipset design that AMD has confirmed but not shown.
The AMD AM5 platform with LGA1718 socket will accommodate CPUs with up to 170W PPT. The first generation of AM5 CPUs is based on the Zen4 architecture with support for DDR5 memory and PCIe Gen5 devices. The X670E and X670 chipsets, with their dual-chipset design, will offer up to 24 PCIe Gen5 lanes for graphics and storage.
Although it has already been confirmed by AMD, the new X670 chipsets do not require active cooling. This greatly simplifies the design of AMD 600-series motherboards, lowers development costs and likely means lower power requirements as well.
The presentation of the Ryzen 7000 and the X670 at Computex is just a small preview of what will (officially) appear in the fall. AMD has promised to release more details over the summer. The B650 motherboards are said to feature a single chipset design, which should mean even smaller heatsinks.
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